Ceramic Semiconductor Packages

Three engineers from fairchild.

Ceramic semiconductor packages. Micro ball grid array μbga. A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads. However the simple construc. Miniature ceramic packages for crystal devices.

Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs. Located in silicon valley spectrum semiconductor materials inc. Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap.

Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. A circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations.

Is a world wide authorized distributor of packages and lids for ic assembly. The body of the component is ceramic. Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins. The pressed ceramic packages are typically lower in cost than the multilayer packages.

These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest. This was the first real semiconductor package. Ceramic column grid array ccga. Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016.

High pin count semiconductor packaging. Ball spacing less than 1 mm. The first semiconductor package. These ceramic and metal can packages are of.

Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements.